Moulding Expo: Next regular trade fair in 2023

The next regular Moulding Expo will be held at Messe Stuttgart according to schedule June 13-16, 2023. (Courtesy: Messe Stuttgart)

Moulding Expo will not take place in 2021. A Virtual Innovation Day will provide access to trade fair highlights.

Since the last Minister-President Conference also did not open up any prospects for the trade fair industry, it is no longer realistic to successfully stage Moulding Expo in June 2021. In addition, organizers felt the risk for everyone involved was too high. The trade fair advisory board, whose members include exhibitors such as DMG Mori, Meusburger, and Deckerform, along with the professional and promotional supporters, i.e. the Federal Association of Pattern and Mould Making (BVMF), the VDMA Precision Tools Association, the German Machine Tool Builders’ Association (VDW), and the German Association of Tool and Mould Makers (VDWF) felt compelled to decide not to hold the trade fair in June 2021.

The next regular Moulding Expo will be held as scheduled at Messe Stuttgart June 13-16, 2023.

In its capacity as the organizer of Moulding Expo, Messe Stuttgart attempted to satisfy the wish of the European tool, pattern, and mould-making industry and its suppliers for the popular and important physical industry meeting point. Road of Tooling Innovation was added to the accompanying program as an additional highlight while the trade fair profile was further enhanced with a revised forum concept and the Aachen Tool Making Academy (WBA) as a new partner.

By staging a virtual Innovation Day on June 10, 2021, the organizers of Moulding Expo want to implement an initial and purposeful measure on the road to Moulding Expo 2023. The objective is to make the highlights from the planned accompanying and talk program in 2021 internationally accessible at no cost despite the cancellation of the physical trade fair. This virtual Innovation Day is being organized in agreement with and through the support of the trade fair partners. Further information and a detailed program will be published shortly.