Oberg Industries offers the world’s most advanced grinding technology with Molecular Decomposition Process™ (MDP™). Developed for the most efficient removal or cutting of any conductive material, MDP uses an electrochemical action and an abrasive wheel to achieve surface finish of less than 1 RA and precision tolerances held to ± 0.0002", all without generating heat. The process is ideal for use with consumer or industrial products where surface finish and dimensional stability are imperative. MDP is also suitable for applications requiring a surface free of micro cracks and fissures or other highly polished weight bearing and articulating surfaces. Gentle enough to grind thin-walled components without damage or distortion, MDP works well with tubing, rapid cut-off needs, and grinding of complex features in exotic metals, including nitinol.
“No other method of grinding or cutting can compare in performance with its speed, precision, repeatable accuracy, and clean operation,” says Joe DeAngelo, director of technical development. “MDP can even eliminate secondary operations such as electro polishing, micro blasting, and deburring without generating thermals or causing internal stress and distortion in the material. Its applications are endless.”
During MDP an electric current flows between the negatively charged abrasive wheel and the positively charged workpiece through an environmentally friendly electrolyte (saline) solution. A decomposing action occurs, causing the material surface to oxidize. This oxidized surface is then removed by the specially formulated abrasives in the wheel, exposing more material and repeating the cycle. MDP cuts conductive materials 80 percent faster than conventional methods and is especially effective on super-alloys and exotic metals. It can be used with the following conductive materials: aluminum, beryllium, cobalt chrome, copper, inconel, iridium, molybdenum, nickel, nitinol, platinum, rhenium, single crystal alloys, stainless steel, titanium, titanium carbide, tungsten carbide, zirconium, and other conductive ceramics and plastics.
After working closely with Compositron Corporation for over five years to further develop and refine the process, Oberg acquired the MDP technology and the full consumable products line of Voltron™ grinding wheels and electrolyte in July 2007. Voltron grinding wheels and electrolytic solution continue to be manufactured and developed at Oberg’s Sarver, Pennsylvania, campus to fit a variety of cutting and grinding applications.
To learn more go to [www.oberg.com].
