Seco to host seminar for mold & die manufacturers

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Seco Tools will host a special educational event in collaboration with leading partners in the mold and die industry.

The event, which will showcase tips, tricks, and cutting-edge solutions for machining difficult steels and hardened materials, will be at the company’s Troy, Michigan-based headquarters July 26, 2018 from 8:30 a.m. to 4 p.m. In addition to numerous product demonstrations in the company’s newly upgraded technical center, the event will include information from featured partners hyperMILL and Heidenhain as well as a keynote presentation by guest speaker Dr. Jens Kummetz, head of marketing and product management controls for Heidenhain.

Attendees at the seminar will have the opportunity to learn more about the machining of complex 2D and 3D surfaces such as mold cavities, gates, heat-sinks, and die pockets. Topics will include blending techniques, 5-axis precision machining, and roughing/finishing strategies for hard milling and machining strategies for small lot sizes. While these topics will primarily address the challenges faced by manufacturers in the mold and die industry, the content presented in the seminar could be applied across all industries.

Machining demonstrations will be on Seco’s new second generation Grob G350, a simultaneous full 5-axis Universal Machining Center that features glass scales, standard chiller unit, and intelligent chip management. The new Heidenhain TNC640 Mill-Turn control also will be on display as the centerpiece for Dr. Kummetz’s discussion of the science behind CNC systems and the time-saving innovations that are pushing the technology forward.

To register for this opportunity to experience the results that premium tooling, machine tools, and software can provide, go to www.secomarketing.com/moldanddie18 and RSVP by July 13.